Understand the LED lamp bead only to master the 11 steps - packaging production process China lighting network

Was first choice, choose the right size, luminance, color, voltage, electric current of the LED lamp bead encapsulation chip, below is the equinoctial description 1, crystal, and use the expansion machine manufacturers to provide the entire LED chip film uniform expansion, make the closely arranged leds attached to the membrane surface grain, is advantageous for the crystal. 2, back glue, will enlarge good crystal crystal ring on expanding has good silver pulp layer back glue scraper, silver paste on his back. Silver paste. Suitable for bulk LED chip. Use will be just the right amount of silver pulp point glue on the PCB printed circuit board. 3, solid crystal, silver paste expansion of crystal ring into the thorn lattice, by operator under a microscope to the LED chip with barbed crystal pen thorn on the PCB printed circuit board. Good 4, crystal, the crystal of PCB printed circuit board in the heat cycle oven thermostat let stand for a period of time, after waiting for silver slurry curing remove ( Not for a long time, or LED chip coating will bake huang, oxidizing, caused a difficult) to dependend 。 If you have the LED chip bond, requires more than a few steps; If only the IC chip bond rule to cancel the above steps. Line 5, welding wire, aluminum wire welding machine will chip and the corresponding PCB solder bridge aluminium wire, wire welding in the COB. 6, preliminary survey, using a dedicated test tool ( Have different equipment, according to the different USES of the COB is simple with high precision regulated power supply) Detection of COB board, will unqualified boards to repair. 7, point glue, used to allocate a good AB glue adhesive on the appropriate location to bond the scheduled LED grain, IC is encapsulated with vinyl, and appearance of packaging according to customer's requirement. 8, curing, will seal glue PCB printed circuit board or lamp holder in the heat cycle oven temperature let stand, can be set according to requirements of different drying time. 9, the total measurement, the encapsulation good PCB printed circuit board or fixtures are electrical performance test, using special testing tools to distinguish good or bad. 10, spectral, by spectrophotometry machine will lamp brightness, according to the requirement of different brightness packaging respectively. 11, put in storage, and then to move out of the batch is for everyone to create a comfortable LED lamp bead encapsulation and energy saving life.

YanZhiXiang

the LED screen mesh