Science and technology innovation: gyu chip packaging high-power LED lighting, Products) Application technology

Project results ( Main USES, the technical principle, key technology and innovation points, application and benefit situation, there is a problem) :

1, 'more chips encapsulation of high power LED lighting application technology' is a project of shanxi gyu semiconductor lighting co. , LTD. , in the master, 'superconductive heat conductive material has mastered the highlight key white LED encapsulation technology' is put forward on the basis of. Put forward the main of this project is to solve the high power LED technology more chip packages, packaging of high power LED light source, and developed a series of LED lighting products, design for LED a successful application in the field of general lighting creates a new road.

2, project technical scheme and technical principle:

( 1) High thermal bonding materials in developed on the basis of new synthetic methods and new material doping technique, develop new insulating thermal conductive materials and in reducing the thermal resistance between body of light and heat dissipation, lower chip junction temperature at the same time, improve the fight against wear ability of the chips, ensure the safety and reliability of lamps and lanterns.

      （ 2) Through reasonable optical simulation, using the mature software design, further improvements to the existing framework, and combining with the actual test results improve stent structure design, to meet the new stents in guarantee under the condition of heat flow, improve the efficiency of integrated encapsulation type light source the light of purpose.

      （ 3) Optical model, integration of development suitable encapsulation type high power LED lamps and lanterns of the reflector, a more effective use of LED light, improve the efficiency and can satisfy the demands of different places lighting lamps and lanterns.

      （ 4) The integral heat treatment, and, through the calculation of thermal simulation for the whole system from the LED chip to the lamps and lanterns of lamps and lanterns of the heat dissipation body to provide a clear heat transmission channels, make the heat generated by the LED chip can timely rapid conduction into the air, the greatest degree of guarantee the service life of the light source.

      （ 5) The reliability of the lamps and lanterns of research;

based on the overall heat dissipation mechanism, the structure of the lamps and lanterns of lamps and lanterns, the power mechanism of aging, LED encapsulation material aging, deterioration of phosphor, electrostatic effect of LED the research of the influence of life, to find the main factors influencing the reliability of lamps and lanterns. 3, project achievements of

the project based on the research of the encapsulation structure, the thermal conductive materials, solves the problem more chip encapsulation cooling technology, successful package out of the power of 100 w, luminous flux 8000 lm single-chip LED light source, designed to develop a series of LED lighting products, Including tunnel light, street light, industrial and mining lamp, floodlight, indoor lighting) , and successfully applied in the lighting field, the technical innovation points are as follows:

( 1) Successfully solved many chip packaging technology, design develop the more chips encapsulation high-power LED light source, power is 100 W, initial photosynthetic efficiency of 80 lm/W, 50 W can reach 100 lm/W.

      （ 2) The integral, systematic cooling concept, from chip to the external environment of the cooling model is set up; Developed thermal insulation interface filler material, reduce the light source and lamps and lanterns of heat dissipation thermal resistance.

      （ 3) Developed to meet different places lighting light distribution system.

4, application and existing problems of

and high-power LED and application products to achieve industrialization, must carry on the overall innovation from the aspects of key technology, the key technology and will continue to optimize the parameters, especially the development of high performance low price of high power LED products is to determine an enterprise in the open the key to winning the LED lighting of war. How to get the LED lighting industry into the traditional lighting industry chain, in order to realize the purpose of the use of the existing industrial foundation cost reduction, not only is the integration of industrial chain, is constantly breakthrough new technology to solve the problem. Therefore, we need to further develop the technology innovation, talent and patent development strategy, constantly improve the enterprise research and development ability and core competence, comprehensively improve the quality of power type LED products production and industrialization level.

editor: China lighting network - Xiao-guang qiao