Packageless chip technology becomes the focus of LED lighting industry in 2013

Unpackaged chip technology has become the focus of the LED lighting industry. From the perspective of the manufacturing process of LED lighting products, it is divided into level to level manufacturing processes. Among them, Level is the process of epitaxy and chip, while Level encapsulates LED chips, and Level solders LEDs. On the PCB, Level is the LED module, Level is the lighting source, and Level is the lighting system. The LED factory's non-packaged chip technology has mostly developed towards the omission of Level. Philips Lumileds is actively expanding its product line in the year. In addition to laying out low- and medium-power product lines, it has also recently announced the launch of high-power LED package components LUXEON Q. This is Philips Lumileds**'s high-power development based on flip-chip technology. LED, and uses Philips Chip Scale Package (wafer-level chip scale package) technology. Philips Lumileds*’s newly launched LUXEON Q uses CSP technology and flip chip technology to achieve high power and high lumen performance. It is understood that Philips Lumileds’ previous thin-film flip-chip technology must remove the sapphire substrate during the subsequent process. LUXEON Q uses a new generation of flip-chip technology, which eliminates the need to remove the sapphire substrate in the subsequent process. LUXEON Q lock directly replaces a series of products that are already quite familiar and mature in the market. The application range includes patio lights, ceiling lights, exterior wall lights, replacement bulbs and special lighting applications. Taiwan’s LED chip manufacturers are also active in the development of unpackaged chip products. Jingdian ELC’s new products use semiconductor manufacturing processes, which will omit the packaging (Level) part, including the previous lead frame and wire bonding, and only leave the chip. It can be used with phosphor powder and packaging glue, and it can be directly mounted on chip (SMT). It is reported that Jingdian ELC products have entered the backlight supply chain and will also be used in the lighting market in the future.