LED unpackaged products are born in response to low prices

The trend of low-cost LED also makes manufacturers constantly think about ways to reduce production costs. LED unpackaged products have become a major industry focus in 2013, including Taiwan LED chip factory Jingdian, Longyuan, one-stop factory Taiji solid-state lighting, Lunda, international manufacturers Toshiba, CREE, PhilipsLumileds are all actively investing in the research and development and production of unpackaged products. However, most unpackaged products are still at a stage where only the stairs are heard and no one is seen. The production yield of unpackaged products affects the speed of mass production of this product. Judging from the unpackaged products currently introduced by LED chip factories and one-stop factories, the unpackaged products of crystal power mainly push ELC (EmbeddedLEDChip) After the chip production is completed in the process, it is only necessary to coat the fluorescent powder and use the packaging glue, omitting the steps of the lead frame and the line, and can directly patch (SMT) In use, ELC products have a large luminous angle without a lead frame, and there is also an opportunity to omit the use of secondary optical lenses in the future. However, TSMC solid-state lighting named its unpackaged product PoD (Phosphorondie), Take the flipchip (Covering crystal) The chip is placed on the heat dissipation substrate, omitting the steps such as the lead frame and the wire, and also has a small volume with higher luminous flux, a large luminous angle, and easier color mixing and color temperature control characteristics, suitable for non-directional light source applications. Yuanyuan 2013 is also actively promoting its unpackaged products. It is also based on flipchip and omits the steps of lead wire frame and wire making in the manufacturing process; Lunda also unpackaged CSP ( ChipScalePackage) The product is introduced into the lamp tube application, and the Londa CSP product also uses the cladding technology in the upstream grain, and also omits the lead wire frame and simplifies the packaging process. CREE and PhilipsLumileds also actively declare the research and development results of CSP products. LUXEONQ launched by PhilipsLumileds uses flipchip technology and does not need to remove sapphire substrate in the later process. lock-in directly replaces the 3535 package specifications that are popular and mature in the market. And CREE's XQ- ELED products also adopt CSP technology, which greatly reduces the chip area and XP- E2 has the same lighting grade performance, while the size is reduced by 78 to only 1. 6mm * 1. 6mm, its miniaturized design can improve light color quality and optical control, and expand the scope of lighting applications.