Top ten technology hotspots in China's LED industry in 2014

After 2013, I saw the ups and downs and hot spots in the LED market in just one year. We also saw that the technology market is unwilling to lag behind and frequently produce new hot keywords for new technologies. First COB, HV- LED, eutectic technology, COB hot technology market, and then to cover crystal, flip, package-free technology market climax, the post-LED industry needs the localization of mocvd equipment, the future of intelligent lighting and the modular packaging to achieve the future trend of the entire LED industry. All kinds of signs show that the entire LED lighting industry technology is undergoing unpredictable market testing and testing. At the end of the year, let us review the top ten technology hot keywords worthy of historical memory. Key words 1. COB with the decline of LED market price, the huge market of general lighting application and the strong demand in commercial lighting, special lighting, backlight and other fields have promoted the improvement of LED light source unit brightness. The COB Package has good horizontal and vertical heat dissipation performance under limited volume, and is suitable for achieving greater power in a small area. It has the following advantages: 1. Superior performance: using cob technology, the bare die of the chip is directly bound to the PCB board, thus eliminating the requirement for wire bonding connection, make the product performance more reliable and stable. 2. Higher integration level: cob technology is adopted to eliminate the link pins between the chip and the application circuit board and improve the integration level of the product. 3. Smaller volume: cob technology is adopted. As binding and mounting can be carried out on both sides of pcb, the volume of cob application module is correspondingly reduced and the application space of cob module is expanded. 4. More ease of use and more simplified product process: the cluster bus technology is adopted, and pins are adopted between cob boards and application boards to facilitate interconnection, it eliminates the technological processes such as welding that must be passed when using chips, reduces the difficulty of using products, simplifies the product process, makes products easier to replace, and enhances the ease of use of products. 5. Lower Cost: cob Technology is directly bound and packaged on PCB board, which eliminates the cost of chip implantation, welding and other processing processes, and the design of user board is simpler, the cost of embedded products is effectively reduced. Key word 2: HV- Led hvled, as its name implies, is a high-voltage LED. Compared with traditional DCLED, it has the advantages of low packaging cost, high warm white light efficiency, high driving power efficiency, low line loss, etc. Specifically: 1. HVLED directly realizes series-parallel connection of micro-grains at the chip level, making it work under low current and high voltage, which will simplify the number of chip solidification and bonding and reduce the packaging cost. 2. HV chips form integration of multiple micro-grains per unit area, thus avoiding the consistency problems caused by the span of wavelength, voltage and brightness in the inter-chip BIN; 3. HVLED chip is a power chip driven under small current, which can be integrated with red LED chip. Yellow fluorescent powder forms warm white light, which is better than traditional DCLED red fluorescent powder, the warm white light formed by yellow fluorescent powder has high light emitting efficiency, shortens the gap between the light efficiency of LED warm white and cold white packaging, and makes it easier to realize the high display of light source;