Thermal management of LED technology including chip thermal management, encapsulation, and system integration. Chips, efforts to improve the quality of the crystallization of material or design of the new type of structure, to improve the internal and external quantum efficiency, of the chip itself is lower than that of the traditional thermal conductivity of the sapphire substrate thermal resistance smaller chip.
chip ( Quantum efficiency; Power density. Thermal expansion; Substrate materials, etc. ) LED thermal management package ( Packaging materials; Encapsulation structure; Encapsulation process, etc. ) System integration ( Refrigeration technology; Materials; Process, etc. ) LED heat dissipation structure ( Illustrations path using illustrations LED heat dissipation structure)
1, the necessity of the LED heat dissipation ( Heat dissipation problems is the current technology of semiconductor lighting technology bottleneck) LED is a photoelectric device and its working process is only 10% ~ 40% of the electric energy into light energy, almost all the rest of the electrical energy is converted into heat energy, raise the temperature of the LED. LED temperature is the main reason most of the LED performance deterioration and failure. The LED junction temperature rise, results in the decrease of luminous efficiency, poor reliability, reduce the service life and increase calorific value and so on.
2, solution profile LED thermal management
( A) To improve the LED chip, packaging structure and materials - — Aggregate industry ( B) System integration, mainly for the cooling way of lamps and lanterns, and improve the heat transfer power - — Thermal design work
3, LED lamps and lanterns of the cooling structure analysis chip ( The node temperature control in
Sophy
China lighting network