Making LED lighting industry development up to now, the white light lighting has been unable to effectively solve the encapsulation material degradation due to poor heat dissipation, the problem of low efficiency of luminescence.
For reasons including LED encapsulation cooling way, LED encapsulation, PCB, heat dissipation fins environment layer upon layer cut off is not smooth, hard but mutual understanding of the upstream and downstream industries, and therefore difficult to integrate advantages and design the high heat dissipation of LED products, light sea science and technology, with its excellent technology and design ability will LED encapsulation, PCB, the heat dissipation module integrated in the same cooling module, get 60 w high power LED module the Tj for 61.
11 ℃ of excellent results.
efficiency of LED product performance index
glow lm/w: the control factor of the luminous efficiency of grain size, respectively proportion of phosphors, the cooling rate.
Tjunction temperature control or life or light attenuation control: the grain itself to bear a considerable degree of thermal shock (
Each ascending temperature 10 ℃, luminous efficiency decline is less than 1%),
, however hot for all types of fluorescent material effect is relatively sensitive, fluorescent material of light conversion efficiency decreases with temperature rise (and
FIG. 1)
, affecting the service life of fluorescent material at the same time, especially when fluorescent material temperature over 70 ℃ or more rapid decline, which means that the LED junction temperature (
JunctionTemperature Tj)
Must be controlled under 70 ℃, can effectively ensure the service life of the LED (
General to L70 life calculation, recession LED to 70% of the time the original brightness)
Judgment, as the life, the requirements are general in more than 20000 hours.
as a result, the control ability of Tj determines the LED luminous efficiency and life of light directly to the LED chips encapsulation sea science and technology developed in all panels (
Vaporchamber)
The following advantage on technology,.
directly to the LED chips encapsulation in all panels, chips and mean temperature between only the Bonding layer thermal resistance (
Figure 3)
, and non-traditional module (
Figure 4)
Layers of structure of thermal resistance.
all panels, coefficient of thermal conductivity of at least 800 w/mK 400 w/mK 2 times is pure copper, aluminum nitride substrate 230 w/mK 4 times, aluminum base plate (
MCPCB)
3 w/mK 260 times, and excellent capability of thermal conductivity is obtained.
60 w high power LED module through the measured Tj = 61.
11℃(
Figure 6)
, the lowest Tj is measured by the industry.
easy to control: sea science and technology of the LED module light, because both temperature only a Bonding layer between plate and the chip, measuring the temperature of all panels is almost equal to Tj, as a result, the area of the need to control the cooling fins can easily control the Tj, and control of Tj is equivalent to control the LED life.
low cost: the high power module because there is no previous LED module, function structure of the house, directly to the LED chip bonding on the mean temperature board, in the middle of the process materials have been omitted, so its cost is the most competitive model.
borrow developed by its excellent design ability will directly LED chips encapsulation on the mean temperature board technology, thoroughly solved the problem of the high power LED module cooling bad, for the high power LED modules, create a new path.
