Despite the LED street lamp technology developed rapidly, but many users are commonly used for LED street light, there is a error, think the LED street lamp application is advantageous to the heat dissipation in a cold district, it is not easy to malfunction. In fact is not the case, cold application environment, has more strict technical requirements for the LED street lamp, cold area with low temperature, and temperature difference is big, the change of hot and cold shock and long-term work for cryogenic device has more stringent quality requirements. Due to the outdoor LED street light after the chip packaging, belong to solid solid device, there is a chip, silicone, metal stents, and lead the expansion coefficient mismatch between phenomenon, plus a larger temperature difference in the cold region of hot and cold impact, can make the silica gel in the process of temperature change, expansion and contraction intensifies, internal stress, this will lead to the LED wire bonding point displacement increases, lead early fatigue and damage. It will also make originally bonding state of poor solder joints may appear to take off the welding, and welding ball and chip electrode sealed off phenomenon, even the LED lighting lamps chips appear statified off failure phenomenon. A light LED lights LED devices as many as hundreds of applications, usually adopts mainly series of mixed transmitte state method, if a single LED fails, will cause joint failure more than LED, so the application in cold region of LED street lamp first to use the lamps and lanterns of environment temperature change according to the specific features, set up reasonable ultrasonic power, the bonding pressure, the bonding time and bonding encapsulation process parameters such as temperature, ensure that every LED the reliability of the device in low temperature environment. Want to learn more industry information or ask price, can make free calls