LED lighting industry has entered the 'no packaging era'

LED lighting industry is one of the strategic emerging industries in China's 12th Five-Year Plan. The industry is developing very rapidly and has great potential in the application market. Due to the lack of standardized and Unified light components and lamp standards, it poses severe challenges to the development of the whole industry, and at the same time restricts the healthy development of LED lighting industry to a certain extent. In recent years, the flip-chip non-gold wire chip-level packaging device introduced by Jingke electronics has creatively combined flip-chip technology with non-gold wire chip-level packaging, with more stable performance, better heat dissipation, more uniform light color distribution and smaller volume, it is favored by more and more LED lamp enterprises and terminal product application enterprises. So what is a gold-free package? In integrated circuit packaging technology, the connection between wafer electrodes and bracket pins is generally achieved by means of gold wire interconnection, but gold wire fracture has always been one of the common failure causes. With the introduction of flip chip technology, the connection between the two can be connected by more stable metal bump solder balls, thus omitting gold wire and greatly improving its reliability and heat dissipation capability. Later, flip-chip technology was also used in LED packaging technology. LED has the advantages of long service life and the like. With flip-chip technology, the advantages of LED can be brought into play better than the traditional packaging technology using gold wire interconnection, it is called a gold-free package. At present, the representative enterprise that can mature the application of this technology is Jingke electronics.