LED industry continues to face price reduction pressure after entering the lighting era1

After entering the era of lighting, the LED industry is still facing the pressure of price reduction. LED factories are competing to invest in the development of unpackaged chips. LED factories PhilipsLumileds, Toshiba, TSMC solid-state lighting, crystal power and round non-packaged chip products have been launched one after another, following crystal power ELC (EmbeddedLEDChip)Technology and round PFC (PackageFreeChip) After the debut, PhilipsLumileds immediately launched the use of ChipScalePackage (Wafer Level chip size package)Technology, and has been coated for the first time (flip-chip) LUXEONQ, a high-power LED packaging element developed on the basis of this, is undoubtedly the focus of the 2013 industry. According to the manufacturing process of LED lighting products, it is divided into manufacturing processes from Level0 to Level5, among which Level0 is the manufacturing process of epitaxial and chip, while Level1 encapsulates LED chip, level2 is to weld the LED on the PCB, Level3 is the LED module, Level4 is the lighting source, and Level5 is the lighting system. LED factory no package chip technology to omit Level1 development. PhilipsLumileds expanded its product line in 2013 with active steps. In addition to the layout of medium and low power product lines, it also recently announced the launch of LUXEONQ, a high-power LED packaging element. This is the first time PhilipsLumileds has used flip- High-power LED developed based on chip technology and Philips ChipScalePackage (Wafer Level chip size package)Technology. PhilipsLumileds's new LUXEONQ uses CSP technology and cladding technology to achieve high power and high lumen performance. It is understood that the previous generation of PhilipsLumileds is thin-filmflip- Chip technology must remove the sapphire substrate during the later process, while LUXEONQ uses a new generation of flip- Chip technology does not require the removal of the sapphire substrate in the subsequent process. LUXEONQ locks directly replace the 3535 series products that are quite familiar and mature in the market. The application scope includes patio lamps, embedded lamps, exterior wall lamps, replacement bulbs and special lamp applications. Taiwan's LED chip factory is also active in the development of unpackaged chip products. The new product of Crystal ELC adopts semiconductor process, which will save packaging (Level1) Part, including the past lead frame, the line is not needed, only the chip is used with the phosphor and the packaging glue, and can be directly applied (SMT) It is reported that Crystal ELC products have entered the backlight supply chain and will also be used in the lighting market in the future. Hong Yuan has also developed PFC package-free products. Chip design based on flipchip does not require wiring. The advantage of PFC package-free chip products is that the light efficiency is increased to 200lm/W. the ultra-wide-angle full-cycle design with a luminous angle greater than 300 degrees, plus the use of secondary optical lenses, will reduce the loss and cost of light efficiency.