LED chip production capacity surges, flip-chip LED chips dominate

In recent years, China, the United States, the European Union and other countries and regions have successively implemented the white ban policy. The market for LED energy-saving bulbs has been further promoted, and the prices of LED lighting products have continued to decline, these all directly drive the rapid increase of LED lighting permeability. In the three to five years from 2014, the LED lighting industry will usher in explosive growth and enter the Golden three years. As the leading link, the manufacturing technology of upstream LED chips and the corresponding packaging technology jointly determine the future development speed of LED in the lighting field. With the continuous expansion of upstream chip production capacity, the packaging industry has entered an era of low profit. Many enterprises are playing a big price tag in order to snatch customers, fierce price competition and disorderly industry ecological chain have prompted the industry to begin to demand new packaging technologies. The innovation and application of flip-chip LED chip technology with the advantages of improving luminous efficiency and heat dissipation capability is the focus of today's packaging enterprises on research and development. Compared with the formal chip, the Flip Chip (Flip-chip)Has better heat dissipation function; At the same time, we have epitaxial design, chip technology and chip graphic design suitable for flip chip. Chip products have the advantages of low voltage, high brightness, high reliability, high saturation current density, etc; In addition, the protection circuit can be integrated on the flip-chip substrate, which is obviously helpful to the reliability and performance of the chip; In addition, compared with the formal and vertical structure, the flip-chip welding method is easier to realize the chip light source technology of ultra-high power chip-level module and multi-function integration, it has great advantages in the yield and performance of LED chip modules. In terms of light efficiency, the inverted structure avoids the light absorption of the conductive layer on the P electrode and the shading of the electrode, and can also be used in the p-GaN has a reflective layer to improve the luminous efficiency. In the long run, flip chip will reduce the process of packaging and squeeze the packaging industry. In addition, reversing the chip may lead to an increase in the driving power of the chip, reducing the actual consumption of the chip by the lighting backlight application in disguised form, and changing the long-term demand for the chip by the lighting application.