'Joint research and development of adhesive technology for LED flip chip' project

Recently, entrusted by the international cooperation department of the Ministry of Science and Technology, the Hebei provincial science and technology department organized experts to accept the joint research and development of LED flip chip adhesive technology undertaken by Hebei Daqi Optoelectronic Technology Co. , Ltd. Through reviewing the project's technical data, on-site inspection, questioning defense and other procedures, the project has been highly praised by technical experts inside and outside the province and passed the acceptance smoothly. The international scientific and technological cooperation project has studied the key technologies such as the new technology of LED chip flip-chip adhesive, high-performance heat dissipation substrate, and the preparation of anisotropic conductive adhesive through cooperation with Japan Bridge Manufacturing Institute, A new technology of LED flip chip gluing has been developed; The COB light source using LED flip chip adhesive packaging process accommodates more than 30 more chips than the COB light source in the same area, and the total luminous flux is increased by more than 50; The thermal conductivity of the developed special substrate has reached 386 W/m. K, greatly improving the heat dissipation performance; Apply for 1 invention patent and obtain 3 utility model patents. Through international scientific and technological cooperation, we have overcome many technical problems such as LED flip chip gluing, established a stable and effective cooperation mechanism, and formed a stable research and development team in the enterprise. The project effectively solves the technical problems of poor thermal conductivity, poor electrical conductivity, low light emitting efficiency, poor reliability, and a small number of chips per unit area. After the LED flip chip gluing process is mature, a new technical route will be formed in the LED packaging field, which is a major technological breakthrough and fills the gap in the domestic LED flip chip gluing process. The application of this technology will replace the formal bonding process on a large scale and realize the upgrading of LED packaging technology.