'Free Packaging' will change the current LED packaging pattern

It is difficult to have new technologies in the LED chip field, and most of the new technologies in the application field are in design and Intelligent Systems. The reform power of the new technologies is not large and the life cycle is quite short. However, as the packaging of the middle link of the entire LED industry chain, the power of its new technology is very great. New packaging technologies have brought about changes in the industry, from single chip to multi-chip integration to chip packaging on board (COB Package)The LED light source has undergone two changes. A few years ago, single chip packaging was widely used in packaging technology, 1 W/chip or 0. 5 W/straw hat lamp bead is the choice of most LED lamps, but in the past two years, with the popularity of patches, multi-chip integrated packaging has become a common packaging form for high-power LED components, it can be divided into medium and small power and high power chip integration components. Let's look at chip packaging on the board. At present, COB packaging has become a new direction adopted by packaging manufacturers and application enterprises. In major LED lamp stores, COB light sources are mainly LED downlights, LED spotlights, LED panel lights, etc. In packaging manufacturers and application enterprises, the production scale of COB packaged products is not large, but because the packaging form is mostly based on low-power chips, increasing the heat conduction area and effectively improving the heat dissipation defects, it has become the new favorite of LED enterprises in the middle and lower reaches in the past two years. EMC and SMC packaging technologies have become the mainstream in the market. There are many and varied packaging manufacturers in mainland China, with large production capacity and uneven quality, well-known packaging manufacturers such as jufei Optoelectronics, Ruifeng Optoelectronics, Guoxing optoelectronics and other listed companies have a large market share, but they cannot gain a high reputation in the world, the main reason is that the mainland packaging manufacturers have no major breakthroughs in technology, and they are not superior in quality. At present, in the packaging field, most of them are EMC packaging (Epoxy film plastic seal), SMC/SMD package (Most of them are in the form of patches) Technology, in the market, especially in the LED indoor lighting market, Patch has become a popular light source on the market, because the above two technologies can realize large-scale production, reduce production costs and make the design more flexible. The market in mainland China mainly focuses on medium and small power. In the field of LED indoor lighting, due to the low cost, mature technology and stable quality of medium and small power patches, medium and small power integrated components are the mainstream of the market, however, there are also packaging enterprises with higher technical strength that have introduced high-power patches, such as Shenzhen Haotian Optoelectronics. No packaging technology has changed the current pattern of the industry. At major lighting exhibitions, there are a large number of EMC packaging and SMC/SMD packaging products. There is no doubt that, EMC and SMC packaging will become the future trend of domestic LED packaging. However, in the second half of last year, a new packaging-free technology, ELC packaging technology, emerged in the industry. Taiwan Jingdian and Xiamen tongshida lighting in the mainland have both developed non-packaging technology, but this non-packaging technology has the same effect as non-drive technology. In fact, ELC packaging technology is also a kind of packaging, but it is only a brand-new and advanced technology. However, the emergence of this technology will inevitably bring profound changes to the existing pattern in the LED packaging field.