Challenges of LED packaging in lighting and backlight applications

The emergence of cost-competitive LED has caused a paradigm shift in the lighting industry. In the past ten years, new materials, new processes and manufacturing economies of scale have promoted the rapid and rapid development of LED technology. Backlight TV, display, mobile phone and other IT industries have been the main driving force for the growth of LED market so far. At present, LED backlight has penetrated more than of the TV market. General lighting is gradually replacing IT as the dominant force, pushing LED to rapidly penetrate into the broader market. Liu Guoxu said that the requirements of the backlight market for LED packaging have shifted to achieving better design and performance, such as thinner televisions, narrow borders, higher resolution and wider color gamut. However, the indoor and outdoor lighting market still pays attention to LED lumens per watt (Light effect)And lumens per yuan (Cost). Price reduction and performance improvement depend on more advanced epitaxial and chip technologies, better optical systems, smarter drive circuits, and innovative thermal management methods. Packaging, as the middle stream of LED value chain, directly affects the cost performance, light quality, color reproduction and reliability of end products. In the speech, Liu Guoxu elaborated on the development status and technology trend of LED packaging, as well as the challenges faced in lighting and backlight applications. LED lighting will include three penetration stages: from LED replacement lamps to LED lamps to future LED intelligent lighting. The form and function of encapsulation also evolve in accordance with these three stages. For example, the high-efficiency medium-power SMD package is suitable for linear lamps and bulb lamps, and the high-density integration of high-power flip chip on COB is expected to eventually replace ceramic metal halide lamps. High voltage LED chip and linear IC drive technology are helpful for dimming and color mixing and integration with miniaturization, sensing, security and smart home. In terms of backlight, the new green and red fluorescent powder improves the color saturation of TV, and quantum dot technology makes LCD TV achieve OLED quality and realize ultra-wide color gamut. Using wafer-level packaging (WLP) And white light flip chip to realize chip size packaging (CSP) , Will reduce the number of LED in the Direct TV backlight by 50, thus reducing the system cost.