LED packaging manufacturers have big actions, no gold wire packaging is maturing

Recently, it has been reported that the backlight of Samsung Electronic TV products will be fully packaged in flip-chip (FlipChip) Device, this is undoubtedly a positive answer to some practitioners who still have doubts about flip-chip packaging. Tang Guoqing, general manager of Samsung LED China, said with certainty that this year's popular gold-free packaging! Tang Guoqing, a big action, said that from a technical point of view, the gold-free package is relatively mature. At present, Samsung LED has seen the huge market prospect of this packaging form, and has mass production of gold-free high-power packaged light source device 3535B (Second Generation)Ability. It is understood that Samsung LED's gold-free packaging product 3535B has reached 140lm/W (@ 350mA) The company has planned to terminate the production of products using gold wire and go all out to develop gold-free packaging products. In addition to the obvious action of Samsung Electronics, Lunda electronics also exhibited a stent-free light source device on the basis of no gold wire at this year's Frankfurt exhibition, the so-called unpackaged products. the company plans to realize mass production of unpackaged products by the end of the second quarter. The move is also seen as a move by Taiwanese companies to quickly cut into gold-free products. Compared with the full-scale development of Samsung Electronics, Lunda Electronics said that the unpackaged white LED technology is still in its infancy, and it will take some time for the maturity and market acceptance of this product technology to improve. it will not immediately have a huge impact on SMD and cob. In the short term, in addition to actively promoting non-packaged white LED products and technologies, Lunda electronics will still focus on products with high acceptance in SMD and COB markets. However, Lunda electronics believes that in the future, after the product and market are more mature, the unpackaged products are more competitive than the traditional SMD and COB in terms of light efficiency and price. In addition, unpackaged products have the same flexibility as SMD. With the investment of more manufacturers, this technology has the opportunity to become the mainstream packaging form in the future. It can be seen from the attitude of well-known foreign manufacturers that although the gold-free packaging has not yet become the mainstream, it is already one of the flowers, Tang Guoqing said. Downstream enterprises benefit. No matter whether the living conditions of most midstream enterprises will be squeezed by no gold thread, downstream application enterprises will undoubtedly become the beneficiaries of this technology. Previously, TSMC has cooperated with mainland company tongshida lighting to jointly develop and use POD (PhosphoronDie)Lamp Products for packaged devices. As a lighting application enterprise, what is the actual experience of tongshida for this technology? According to the reporter, Liao Guochun, general manager of tongshida LED division, this packaging form does not require reflow soldering at the application terminal, and the packaging factory can also customize the design according to customer needs.