LED Chip Scale Packaging has no obvious performance advantage

Why has LED no packaging technology attracted much attention, and even some traditional packaging companies are worried about being killed? Which fields is it mainly applied? What is the market size in the future? First, let's popularize a concept. The so-called no-package or no-package is actually a chip-level package, that is, a flip chip is directly sealed to the pad at the bottom of the package, without gold wire or bracket, simplify the production process and reduce the production cost. The package size can be made smaller, while the same package size can provide greater power. As the originator of chip-scale packaging, the interpretation of wafer Optoelectronics may be more reliable. Lin Yida, associate of wafer Optoelectronics, said bluntly that chip-level packaging is not without packaging. Now it seems that there is still no way to avoid packaging, so it is impossible to get rid of the life of traditional packaging. Moreover, since the development of LED industry, no packaging technology completely replaces another packaging technology. In Kerui (CREE) Lin Tie, director of marketing in China, believes that the cost advantage claimed by chip-level packaging is not convincing, but sacrifices the simplicity of the original mature process, the packaging process is put into the chip manufacturing process in advance, which increases the difficulty of chip manufacturing and is not conducive to the yield of product production. The original production equipment becomes inapplicable, increase the purchase cost of new equipment, at the same time touch the new process, and then higher technical requirements for production line workers, increase training costs. As far as the current finished products are concerned, chip-scale packaging does not have obvious performance advantages. Why do you want to do chip-level packaging? The final goal is how many lumens can you buy for $1 or RMB 1. I think chip-scale packaging has improved the technology of flip-chip to a higher level and become smaller and cheaper. This year's flip chip is more civilian, more convenient to use, and closer to the SMD package. Mo Qingwei, vice president of the LED chip division of Dehao Runda, clearly expressed optimism. Chip-level packaging can achieve a very large luminous angle. For example, fluorescent lamps are replaced by chip-level packaging to avoid black areas caused by narrow luminous angle of ordinary lights. From the perspective of the application side, no matter what kind of technology, it mainly depends on the cost performance. Osram led expert Liang Yuhua believes that the current price of chip-level packaging products or systems has no obvious advantages, even more expensive than traditional packaging technology. The advantage is that the size is smaller and denser, and it is applied to some fields with high luminous efficiency and high density. How big will the market scale of chip-level packaging be? Li kuncone, director of Hongli optoelectronic engineering technology center, said that due to the advantage of large luminous angle of chip-level packaging, some alternative markets will erupt in the past two years, the market share will probably be 10. Judging from the lighting market, most commercial lighting still tends to focus on small and medium-sized power, while chip-level packaging is still mainly concentrated on high power. Whether small and medium-sized power is necessary to dabble in chip-level packaging remains to be discussed. Osram led expert Liang Yuhua said that in the future, the proportion of small and medium power in lighting will exceed 60 or higher, while the proportion of medium power or COB will drop to 40 and the proportion of high power will only account for 20, only a part of the high-power field replaces the non-packaging technology, which is about 10. In terms of the application in the field of TV backlight, at present, a brand's fist product is 37 inches and millions of units, and the number of devices required for each unit is about 32 to 37, it is just the demand for dozens of KK. Compared with the total lighting market and packaging market, the proportion of chip-level packaging is still very small. Lin Yida also gave his own answer.