Future Development Trend of LED heat dissipation substrate

The main function of the heat dissipation substrate is to provide the power supply and heat transfer medium required by the LED. A good LED heat dissipation plate can transfer 80- 90 of the heat is transferred out, and such a heat dissipation substrate is a good substrate. The current development of LED industry is also focusing on high power, high brightness and small size LED products. The above three factors will make the requirements of LED heat dissipation efficiency higher and higher. however, LED is limited by factors such as package size and cannot adopt too many active heat dissipation mechanisms. Therefore, providing heat dissipation substrates with high heat dissipation and precise size will also become the development trend of LED heat dissipation substrates in the future. The heat dissipation substrate has different designs with the circuit design, LED type and power size, and the reliability and price of the product are important specifications that determine the heat dissipation design. The main function of the heat dissipation substrate is to provide the power supply and heat transfer medium required by the LED. A good LED heat dissipation plate can transfer 80- 90 of the heat is transferred out, and such a heat dissipation substrate is a good substrate. Traditional LED has little heat generation and heat dissipation problem, so as long as general copper foil printed circuit board (PCB)Just fine. However, with the increasing popularity of high-power LED, PCB is no longer sufficient to meet the heat dissipation demand. Therefore, it is necessary to attach the printed circuit board to the metal plate, the so-called MetalCorePCB, as shown in the figure, to improve its heat transfer path. In addition, there is also a method that directly acts as an insulating layer or a dielectric layer on the surface of the aluminum substrate, and then acts as a circuit layer on the surface of the dielectric layer, so that the LED module can directly connect the wires to the circuit layer. At the same time, in order to avoid increasing thermal impedance due to poor thermal conductivity of the dielectric layer, perforation is sometimes adopted so that the heat-Sharing sheet at the bottom of the LED module can directly contact the metal substrate. the so-called chip is directly adhered. According to the different metal substrates used, it is divided into copper-based copper clad laminate, aluminum-based copper clad laminate and iron-based copper clad laminate. Generally, aluminum substrates are mostly used for LED heat dissipation, which are widely used substrates for high-power LED. At the same time, due to the rapid development of LED consumer markets in various fields, higher requirements are put forward for LED heat dissipation, and LED heat dissipation substrates have gradually become a new market. Therefore, some related companies have invested a lot of manpower and material resources in the research and development of high-power heat dissipation substrates, and have made great progress. Some companies' high-power heat dissipation substrates have entered mass production. such as the United States Beggs (Bergquist), Laird, Japan Electrochemistry (DENKA)Wait.