A thermal conductive materials and secondary cooling material is introduced and applied

A thermal conductive materials is introduced and application of

material name

advantage

shortcomings

FR4 board

1. Low cost, easy;

2。 Without considering the insulation properties

1. Shall not apply to the heat sink with electrode design of leds,

2. Need to fill in tin perforation, increase process procedure

3. Need to thicken the copper foil layer to increase the heat transfer efficiency of

aluminum plate

1. General acceptance

2. Hardness is FR4 is high, with the secondary heat conductivity better

3. Electrical insulation above FR4

1. The price is relatively high FR4

2. Is not in the substrate placed

3 other electronic components. Insulation thermal conductivity properties is not easy to master

copper substrate

1. Thermal conductivity properties is much higher than aluminum plate

2. Pull up more easily than low calorific value, conduction temperature

3. Has advantages of aluminum plate same

1. Cost is high, the general design can't apply the

2. With aluminum plate same shortcomings

total gold plate

1. Conduction center without block, the heat conduction efficiency better

2. Can be used in high power application of polycrystalline LED substrate

1. Shall not apply to the heat sink with electrode design of leds,

2. Cost is too high, not suitable for the application of 1 ~ 5 w power

3. Mould cost

composite material plate

1. Coefficient of thermal conductivity is highest, up to 500 w/mK

2. Spent high thermal resistance, no heat in ontology

1. Manufacturing, processing and application difficulty

2. Material stability, there is often doubts of time using the

3. Cost is too high, difficult to commercial production

secondary cooling material is introduced and application of

aluminum - Squeeze type ( Pull litre)

1。 High thermal conductivity coefficient, heat transfer speed

2. Mould cost is low, and cutting length can be arbitrary

3. Processed easily

1. Insufficient hardness/rigidity is

2. Appearance is no change, aesthetic design is not easy to

3. Fins heat dissipation, easier to cause dust accumulation

aluminum - Die casting

1. Shape can be arbitrary change, beautify the appearance of

2. Can be a lot of fast production

1. Mold design and development costs high

2. Low thermal conductivity coefficient, bad heat dissipation

coating material

1. Can increase the shell heat dissipation capacity

2. Can slow down the metal shell oxidation

3. Can beautify the appearance of

1.

2 increased cost. Increase the system thermal resistance

3. Increase processing

junction material introduction

thermal conductive paste

1. Low cost, easy to use the

2. No specific process

1. Not uniform coating, easy to form bubbles

2. Poor product stability for a long time, easy solidified, and the formation of thermal barrier after curing

the silicone pad

1. Long time heat resistance performance is good, can heat resistance of 125 ~ 200 ° C

2. The higher the temperature, thermal conductivity on the

3. Elastic characteristics, is not easy to form bubbles

1. High cost, increase the product cost

2. The thickness is higher, generally at 0. More than 3 mm

hot phase silica gel pad

1. With general silicone pad product advantage

2. In the high temperature silicone will soften to increase the gap filling effect and increase the efficiency of thermal conductivity

1. Not easy after processing, and cannot be secondary use

2. The high cost, increase the product cost

Sophy

China lighting network