TSLC wafer level LED packaging technology has significant advantages

by：ALLTOP 2020-11-19

LED lighting company Taiwan semiconductor lighting (tslc) With high-power LED lamp beads, Taiwan adopts wafer-level LED aluminum nitride substrate packaging process to provide a cost-effective solution. [img] /uploads/allimg/131204/14-13120411192U36. jpg [/img] Taiwan Semiconductor Lighting will hold a new factory completion and new product launch conference on December 20 to announce advanced patch and inkjet fluorescent powder coating technology, lamp beads of 3535, 5050, 6363, 7070 and 9090 specifications can be made on 8-inch wafers with a power of 1- 55 watts, lens angles are 45, 60, 120 degrees and lensless planar silicone. Wang Junxiong, general manager of Taiwan semiconductor lighting, and Lin Yihan, director of marketing, said that tslc has fast production speed, stable quality and excellent uniform fluorescent powder spraying (Phosphorcoating)Technology, fast (5 minutes/tablet), The process yield exceeds 99 (Can be in-Line monitoring compensation). And improve the luminous efficiency by 15. The finished part of the 160-watt patio lamp has passed UL, CE, LM80 and DLC certification. The outdoor waterproof projection lamp has a power of more than 30 watts. It adopts a self-designed linear IC power supply and has high cost performance. Wang Junxiong said that tslc has a number of independent patents and hopes to be positioned as a supplier of medium and high power lamp beads and modules. With a high degree of flexibility and customized production capacity, it is connected in series to the upstream and downstream of the LED industry supply chain, to represent Taiwan to promote the development of LED lighting industry.